272nd RQC Seminar

• 講演者

  Mr. Alex Rommens
  ( MIT )

• 日程

  2026年4月24日(金), 13:00 - 14:00 (1:00pm - 2:00pm)

• 開催場所

  ハイブリッド（Zoom,
  Room S507, 5F, Chemistry and Materials Physics Building, Wako Campus / 和光地区 物質科学研究棟5階 S507 (S51))

• 講演タイトル

  Low Loss Interconnects for Multi-Module Quantum Architectures

• お問合せ

  peter.spring@riken.jp

講演概要
In modular quantum architectures, classical impedance mismatches at packaging boundaries lead to itinerant photon scattering, generating reflections that disrupt chiral interference and limit state-transfer fidelities. To eliminate these macroscopic boundaries, we implement a 3D-integrated flip-chip interconnect between distinct chiplets, utilizing predictive Time-Domain Reflectometry (TDR) and ABCD-matrix synthesis to systematically neutralize parasitic reactances at vertical Indium bump bonds and lateral chip-edge transitions. By mapping our optimized classical transmission efficiencies into the Scattering-Lindblad-Hamiltonian (SLH) framework, we successfully bridge finite-element microwave engineering with open quantum system dynamics. Ultimately, applying adiabatic pulse shaping yields a simulated deterministic remote-entanglement fidelity of 97%, demonstrating a scalable pathway for distributed quantum computing.